With these innovations, the 8935 supports high productivity capture of yield and reliability-related defects at a low nuisance rate, helping both leading-edge and legacy node fabs accelerate delivery of their products-reliably and at lower cost.
DefectWise ® AI technology enables fast, inline separation of defect types for improved defect discovery and binning. The latest generation 8935 inspector employs new optical technologies and DesignWise ® and FlexPoint ™ precise area inspection techniques to capture critical defects that can cause chip failures.
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The 8 Series provides cost-effective defect monitoring for 150mm, 200mm or 300mm silicon and non-silicon substrates from initial product development through volume production. The 8 Series patterned wafer inspection systems detect a wide variety of defect types at very high throughput for fast identification and resolution of production process issues. The Voyager 1035 delivers high throughput and sensitivity combined with deep learning capability to capture critical defects in the litho cell and other modules of the fab allowing process issues to be identified and rectified rapidly.Ĩ Series High Productivity Patterned Wafer Broad Range Inspection Systems Industry-unique oblique illumination and new sensors with a 30% improvement in quantum efficiency produce higher throughput and better sensitivity for lower dose inspection of delicate photoresist layers in applications such as after develop inspection (ADI) and photo cell monitoring (PCM) for EUV lithography. The Voyager 1035 inspector with DefectWise ® deep learning algorithm, separates key DOI (Defects Of Interest) from pattern nuisance defects to improve the overall defect capture rate of the defects that matter, including unique, subtle defects. The Voyager ® 1035 laser scanning inspection system supports production ramp defect monitoring for advanced logic and memory chip manufacturing. Voyager ® Laser Scanning Patterned Wafer Defect Inspection Systems With integrated Artificial Intelligence (AI), the eSL10 employs SMARTs™ deep learning algorithms that discriminate key DOIs from pattern and process noise, enabling capture and classification of critical defects during R&D and ramp.ĪpplicationsDefect discovery, Hotspot discovery, Process debug, Engineering analysis, Line monitoring, Process window discovery Related Productsģ9xx Series: Optical broadband plasma wafer defect inspectors with super resolution deep ultraviolet (SR-DUV) wavelength bands that complement the inspection performance of the 29xx Series for defect discovery on ≤10nm design node devices.Ģ9: Optical broadband plasma wafer defect inspectors that provide yield-critical defect capture on 10nm and below logic and advanced memory devices.Ģ9: Optical broadband plasma wafer defect inspectors that provide yield-critical defect capture on 16nm and below memory and logic devices.Ģ9: Optical broadband plasma wafer defect inspectors that provide yield-relevant defect capture on 2X/1Xnm memory and logic devices.Ģ9: Optical broadband plasma wafer defect inspectors that provide capture of yield-relevant defects on 2Xnm memory and logic devices. Industry-unique Simul-6™ technology provides surface, topographic, material contrast and deep trench information in a single scan, reducing the time required to collect complete information on a variety of defect types. Revolutionary Yellowstone™ scanning mode supports high speed operation without compromising resolution, for efficient investigation of suspected hotspots or defect discovery within a broad chip area. With an innovative electron optics design, the eSL10™ produces high beam current density at a small spot size and the industry’s widest range of operating conditions for defect capture across an array of challenging process layers and device structures. The eSL10™ electron-beam (e-beam) patterned wafer defect inspection system leverages the industry’s highest landing energy and high resolution to capture small physical and high aspect ratio defects, supporting process development and production monitoring for advanced logic, DRAM and 3D NAND devices. Learn what it’s like to join a team making technology advancements that are bigger, and tinier, than the world has ever seen.ĮSL10™ e-Beam Patterned Wafer Defect Inspection System
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